Featured Articles

Analysts expect ARM to do well next year

Analysts expect ARM to do well next year

British chip designer ARM could cash in on the mobile industry's rush to transition to 64-bit operating systems and hardware.

More...
Huawei and Xiaomi outpace Lenovo, LG in smartphone market

Huawei and Xiaomi outpace Lenovo, LG in smartphone market

Samsung has lost smartphone market share, ending the quarter on a low note and Xiaomi appears to be the big winner.

More...
Intel Broadwell 15W coming to CES

Intel Broadwell 15W coming to CES

It looks like Intel will be showing off its 14nm processors, codenames Broadwell, in a couple of weeks at CES 2015.

More...
Gainward GTX 980 Phantom reviewed

Gainward GTX 980 Phantom reviewed

Today we’ll be taking a closer look at the recently introduced Gainward GTX 980 4GB with the company’s trademark Phantom cooler.

More...
Zotac ZBOX Sphere OI520 barebones vs Sphere Plus review

Zotac ZBOX Sphere OI520 barebones vs Sphere Plus review

Zotac has been in the nettop and mini-PC space for more than four years now and it has managed to carve…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Tuesday, 12 February 2013 10:59

Globalfoundries 10nm process slated for 2015

Written by Fudzilla staff

7nm parts by 2017

Globalfoundries seems unfazed by the PC slump and it plans to aggressively shift to new processes over the next few years.

By the end of the year Globalfoundries plans to start churning out 20nm LPM parts for wired applications and networking. In 2014 we should see the first hybrid 14nm XM (extreme mobility) parts, which combine 14nm FinFET transistors and 20nm back-end-of-line (BEOL). A 10nm hybrid process, utilizing 10nm FinFET with 14nm BEOL, is planned for 2015.

Globalfoundries is expected to roll out its 7nm process in 2017. However, high performance cores probably won’t reap the benefits of Glofo’s new processes anytime soon, so 32nm and 28nm parts aren’t going anywhere just yet.

Globalfoundries says it will be able to process around 190,000 300mm wafers per month by late 2013. However, TSMC can already process more than a million 300mm wafers a month.

More here.

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments