Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Sunday, 29 January 2012 03:57

GlobalFoundries prepares for 14nm process node

Written by Jon Worrel

globalfoundries

To be manufactured with Joint Development partners

GlobalFoundries, the world's third largest independent semiconductor foundry, has said that it has already begun planning phases for upcoming 14nm process node technology. This statement marks the first time that the company has publicly announced any 14nm plans, as it has previously only discussed its 16nm process technology which will use EUV lithography techniques. 

According to an interview between EE Times and GlobalFoundries CEO Ajit Manocha, the company's exceptionally positive Q4 2011 revenue results will allow the firm to "keep the momentum going" after a year plagued with diffuculties and setbacks. Manocha said that the company would continue to develop its upcoming fabrication plant in Dresden, Germany which will be the site of 32nm, 28nm and 20nm wafer production.

"In addition, we are working on 14nm and 10nm with our [joint development] partners," said Manocha. "Since we do not have the home-grown R&D, we are using a collaborative model of R&D [with our partners]."

globalfoundries dresden_germany

GlobalFoundries fabrication plant in Dresden, Germany

Manocha also made sure to compare his firm's achievements with rival foundry TSMC (Taiwan Semiconductor Manufacturing Company), noting that GlobalFoundries has already shipped over 700,000 High-K Metal Gate (HKMG) wafers on the 32nm process note, whereas TSMC has only shipped "a few thousand" High-K Metal Gate wafers on the 28nm process node. Of course, it is somewhat audacious to compare one company's 32nm shipments with another's 28nm shipments, especially since TSMC has admitted that the majority of its 28nm production relies on Silicon Oxynitride (SiON) and not High-K Metal Gate (HKMG).

The full interview can be found here

Last modified on Tuesday, 31 January 2012 00:51

Jon Worrel

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments