Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Thursday, 10 November 2011 15:50

28nm Wayne Tegra 4 still slated for 2012

Written by Fuad Abazovic



No delays


Nvidia shared some presentation decks with the press and we have noticed that according to slide 3, pictured below, there are no delays in the Tegra roadmap.

Nvidia listed Tegra 3 (Kal-El) for 2011 and the chip was ready well before August, but the actual hardware, namely the Asus Transformer Prime, was delayed with a shipping date set for December 2011. Tegra 4, codenamed Wayne is a 28nm chip, and we suspect that this will be more than one processor.

We have no evidence at this time, but we expect to see both dual- and quad-core versions. Judging by the current schedule Wayne should be ready to ship by mid-2012 and in the second part of 2012 there should be some phones and tablets based on it. Nvidia might again show Wayne chips at the Mobile Word Congress show in Barcelona, Spain in early February. We expect Qualcomm and TI will use this show to show their latest 28nm chips as well.

The roadmap that was leaked back in September suggested that Kal-El will be succeeded by Kal-El+, a kicker chip in 2012 and that Wayne will only come in late 2012. That same roadmap, has the Gray with Icera integrated modem, something that Qualcomm offers with S4 8969 28nm 1.7GHz dual core chip.

Tegra 3 will be an attractive for many phones and tablets in early 2012, but for the second part of the year we expect that Nvidia can launch dual- and quad-core Tegra 3 Wayne chips to make the competition run for its money.

So far, Qualcomm only has quad core S4 in Q4 2012 or Q1 2013, while TI has OMAP 5 with two high-end and two slower chips approach ready for second part of 2012.

tegraroadmap

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments