Invensas Corporation plans to show off its dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco next week.
The new packaging has thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption, the company tells us.
Multi-core processing and computing virtualization at data centres mean there has to be increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor, Simon McElrea, president of Invensas said. The company claims that a market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.
xFD is a novel multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) upside down and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure similar to that of a window-BGA package. This decreases overall component size with a 25 to 35 percent savings in vertical height over conventional methods. There is a 50 to 70 percent improvement in speed-bin yield due to symmetric top and bottom die performance and a 20 to 30 percent heat transfer advantage.