Featured Articles

Broadwell to be faster than Skylake-S in desktop

Broadwell to be faster than Skylake-S in desktop

Intel will do something that it never did before. It will release two processor generations at once in the desktop space.…

More...
ARM’s signs off on 64 bit ARMv8-A

ARM’s signs off on 64 bit ARMv8-A

British chip designer ARM has just signed off its 50th licensing agreement for its ARMv8-A technology, which includes support for 64-bit…

More...
Intel Business vPro market divided into 7 categories

Intel Business vPro market divided into 7 categories

Just a few years ago we had two market segments for business users. We had desktops and notebooks and now Intel…

More...
GTA 5 will make November release

GTA 5 will make November release

While we have continued to hear that Grand Theft Auto V for the Xbox One, PlayStation 4, and PC will not…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 02 December 2009 13:47

VIA shows new form factor

Written by Slobodan Simic

Image

Palm-sized motherboard


VIA Technologies has shown some quite interesting stuff this year and it's quite a shame that we haven't seen many of those concepts in retail, but once again managed to stun us with its announcement of the new Mobile-ITX form factor. The new form factor is 50 percent smaller than Pico-ITX and it basically fits in the palm of your hand, so this is something that will certainly have a bright future in niche markets.

The new Mobile-ITX measures 6 by 6 centimeters and it is shows how small an embedded industrial PC can actually be. The new form factor aims at portable networked devices for medical and military segments, but we are positive that it can find its purpose in regular everyday use as well.

It has a low power consumption of up to 5W and consists of CPU module card and an I/O carrier board so developers have a full flexibility when it comes to I/O options and the final product functionality. The CPU module has CPU, chipset as well as memory segment, while the second I/O carrier board has bunch of features like CRT, DVP and TTL display outputs, audio, IDE, USB 2.0, PCI-Express and bunch of other ports.

VIA plans to show its first commercial CPU module based on this form factor in Q1 2010 and it will surely be fun to see what developers do with it.

Image

Last modified on Wednesday, 02 December 2009 13:59
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments