Featured Articles

Snapdragon 400 is Qualcomm’s SoC for watches, wearables

Snapdragon 400 is Qualcomm’s SoC for watches, wearables

We wanted to learn a bit more about Qualcomm's plans for wearables and it turns out that the company believes its…

More...
Qualcomm sampling 20nm Snapdragon 810

Qualcomm sampling 20nm Snapdragon 810

We had a chance to talk to Michelle Leyden-Li, Senior Director of Marketing, QCT at Qualcomm and get an update on…

More...
EVGA GTX 970 SC ACX 2.0 reviewed

EVGA GTX 970 SC ACX 2.0 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Nvidia GTX 980 reviewed

Nvidia GTX 980 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
PowerColor TurboDuo R9 285 reviewed

PowerColor TurboDuo R9 285 reviewed

Today we will take a look at the PowerColor TurboDuo Radeon R9 285. The card is based on AMD’s new…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 02 December 2009 13:47

VIA shows new form factor

Written by Slobodan Simic

Image

Palm-sized motherboard


VIA Technologies has shown some quite interesting stuff this year and it's quite a shame that we haven't seen many of those concepts in retail, but once again managed to stun us with its announcement of the new Mobile-ITX form factor. The new form factor is 50 percent smaller than Pico-ITX and it basically fits in the palm of your hand, so this is something that will certainly have a bright future in niche markets.

The new Mobile-ITX measures 6 by 6 centimeters and it is shows how small an embedded industrial PC can actually be. The new form factor aims at portable networked devices for medical and military segments, but we are positive that it can find its purpose in regular everyday use as well.

It has a low power consumption of up to 5W and consists of CPU module card and an I/O carrier board so developers have a full flexibility when it comes to I/O options and the final product functionality. The CPU module has CPU, chipset as well as memory segment, while the second I/O carrier board has bunch of features like CRT, DVP and TTL display outputs, audio, IDE, USB 2.0, PCI-Express and bunch of other ports.

VIA plans to show its first commercial CPU module based on this form factor in Q1 2010 and it will surely be fun to see what developers do with it.

Image

Last modified on Wednesday, 02 December 2009 13:59
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments