Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Friday, 20 July 2007 15:59

DFI goes innovative on P35 chipset

Written by Slobodan Simic
Image

LANParty UT P35-T2R


DFI has announced a launch of its P35 chipset LANParty UT motherboard, Lanparty UT P35-T2R.

We all know DFI as the most enthusiast oriented motherboard maker, especially for its Lanparty motherboard series. DFI was the first to put digital VRM, CMOS clear button called EZ Clear and separate audio module. Today DFI has introduced its vision of Intel's P35 chipset.

DFI LP UT P35-T2R/T3R can be paired with Intel's dual and quad core processors, with support for FSB 1333MHz. Board itself is based on P35 + ICH9R chipsets. The T3R model will support DDR3 memory, while the T2R is a DDR2 motherboard.

dfi_lutp35_sc1

It just wouldn't be DFI Lanparty without something new and different to offer, this time its a new way, or better say approach in cooling the SB, NB and VRM. Concept is the same as we could see on most of the motherboards. Copper (some use only aluminium) pipe that connect heatsinks on SB, NB and VRM. Now the new stuff, DFI will bundle a an extension joint (Transpiper) which is to carry the heat from the heatpipe system on the motherboard out of the case to yet another heatsink which should be positioned behind the PSU fan. Interesting concept, but it will be stuck with cases that has top positioned PSU.

dfi_lutp35_sc2

DFI designers put an effort in Crossfire + Physics design, so the PCIe slots are separated by 2 additional PCI slots. Of course, such high-end board deserves high end 8-phase Digital VRM, overclockers rejoice. Karajan sound module has been replaced with new "Bernstein Audio" module based on Realtek ALC885 chip.

Pricing and availability hasn't been announced, but such high-end board will surely have a high price-tag.

 

 

Last modified on Saturday, 21 July 2007 14:31
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments