Published in Memory
Mushkin preparing a new heatspreader
by Slobodan Simic on18 August 2009
High-end HS for high-end products
According to the picture and some info that we managed to squeeze out of them, Mushkin is working on a new heatspreader that will be a key for the new upcoming Copperhead memory kit series. The info on it is still pretty much scarce as Mushkin is rather excited about the new series.
We must agree that those blocks on top of the memory modules look really good, and according to what we managed to hear, the looks is not what it's all about, and we get the feeling that the new kit might be quite a performer. Mushkin plans to use it on its high-end parts, so we guess that it does a good job in keeping the temperature on the memory ICs quite low.
Apparently, the new Copperhead series will include both DDR2 and DDR3 memory and all the known configurations, like dual, triple, quad, hex and maybe even oct kits. The price and the date of release are still unknown but we will try to get more info on these as soon as we can.