announced that it has begun construction of its first 300-mm wafer fabrication facility located in China. The new plant is known as “Fab 68” and is located in Dalian, in the Liaoning Province of northern China.
The plant will cost an estimated $2.5 billion and will cover nearly 163,000 square meters, including a 15,000 square meter clean room. Fab 68 is projected to be in production by 2010 and will produce chipsets based on a 90-nm process.
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