Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Monday, 10 September 2007 07:27

Intel opens a FAB in China

Written by David Stellmack

Image

Will produce 90-nm chipsets

Intel Corporation announced that it has begun construction of its first 300-mm wafer fabrication facility located in China. The new plant is known as “Fab 68” and is located in Dalian, in the Liaoning Province of northern China. 

The plant will cost an estimated $2.5 billion and will cover nearly 163,000 square meters, including a 15,000 square meter clean room. Fab 68 is projected to be in production by 2010 and will produce chipsets based on a 90-nm process.

Read more here.

Last modified on Monday, 10 September 2007 10:21
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments