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 31 
 on: January 29, 2011, 08:38:17 AM 
Started by roosterbaby! - Last post by rajiv123
Or maybe you are so used to MS way of thinking that linux is too hard for you. Sure linux is not easy but if you dedicate some time, it will work perfectly. Ubuntu is really close to Windows and good thing is once you setup it, it won't break and most of hardware is recognized automatically.



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 32 
 on: January 28, 2011, 10:53:35 PM 
Started by y eye - Last post by y eye
RTOS:

March 21, 2011
 Issue Highlights: The RTOS that "drives"

Lower the overhead in RTOS scheduling
   
How PTS benefits embedded systems designs
   
Introduction to Preemptive Multitasking
   
RTOSes, 'mutexes' fight priority inversion
Editor's Note
The RTOS that “drives” an embedded system is like the driver of an automobile who must do a number of critical tasks simultaneously relating to vehicle operation and safety, while at the same time deal with a variety of lower priority activities inside the car that compete for attention – the number of which seems to increase with every new model.

The Article:  http://i.cmpnet.com/audiencedevelopment/mv/032111_Embedded.html
...




http://www.chibios.org/dokuwiki/doku.php?id=chibios:articles:rtos_concepts


          
 androiddevelopers http://www.youtube.com/watch?v=Jx3pdWBlZ34                   http://www.youtube.com/watch?v=hPUGNCIozp0&feature=channel

1080P 1080P 1080P 1080P 1080P

 33 
 on: January 27, 2011, 07:33:37 AM 
Started by y eye - Last post by y eye
...26Jan11...

Supermicro Solutions based on Intel® Atom™ Processors

Optimized for single-core Atom D410, dual-core Atom D510/D525, single-core Atom 230 or dual-core Atom 330 processor,
these extreme low-power and quiet solutions deliver the best expansion and storage features of any Atom-based platform
and are designed for embedded industrial PC (IPC) applications. Futhermore, these quiet, energy saving solutions make ideal storage,
network appliances, print, or email servers. In addition, Supermicro's mini-tower chassis with advanced user-friendly design features
create a very cost-effective home or office workstation for basic computing including Internet usage, office and educational applications.

Products  Systems  1U [ 5015A-EHF-D525 ]: http://www.supermicro.com/products/system/1U/5015/SYS-5015A-EHF-D525.cfm
manual download: http://www.supermicro.com/support/resources/results.cfm

http://www.newegg.ca/Product/ImageGallery.aspx?ComboImage=combo539631.jpg&ComboName=Supermicro%20Atom%20Dual%20Core%20D510%201U%20Server&ItemList=N82E16816101332,N82E16820231147,N82E16822148433&Item=N82E16816101332

Combo Discount: -$64.99
Combo Price: $394.98

Save $64.99 when purchased together
SuperMicro SYS-5015A-PHF :$359.99
G.SKILL F2-5300CL5S-2GBSQ :$29.99
Seagate ST31000528AS :$69.99
Combined Total:$459.97
Combo Discounts:-$64.99
Combo Price:$394.98

 34 
 on: January 27, 2011, 01:36:26 AM 
Started by y eye - Last post by y eye

Author: Shane Baxtor

NVIDIA release a heap of drivers. It seems there's one coming out every week lately.
Unlike AMD, NVIDIAs betas are really pushed throughout the enthusiast community.
If we did the same kind of thing with the NVIDIA ForceWare drivers as we do with AMD
and its Catalyst drivers, I would be testing ForceWare drivers 24 / 7.
 
The ForceWare 266.58 driver set is more important, because unlike a lot of other drivers this is a WHQL one;
which for people who prefer to only upgrade when WHQL ones make their way to the market, it could well be time for an upgrade.

http://www.tweaktown.com/articles/3798/nvidia_forceware_266_58_performance_analysis/index.html

 35 
 on: January 27, 2011, 01:07:19 AM 
Started by y eye - Last post by y eye

Vicki PowersJanuary 25, 2011

http://www.dmnews.com/mozilla-google-launch-anti-tracking-browser-tools/article/194896/

 36 
 on: January 26, 2011, 09:36:02 PM 
Started by y eye - Last post by y eye
January 2011 View blogs: http://maingearforums.com/blog.php?876-y-eye  

Skulltrail
http://ark.intel.com/ProductCollection.aspx?familyId=1125

...12Jan11...

SAPPHIRE Adds Muscle to Mainboard Line -  Jan 11, 2011
Now offers High End Intel Platforms

http://www.sapphiretech.com/presentation/media/?psn=0004&articleID=3152




...


...26Jan11...

http://www.intel.com/technology/visualtechnology/snb_demo/demo.htm
Motherboard & Barebones Selector Guide
http://mbsg.intel.com/mbsg/default.aspx


...



 37 
 on: January 26, 2011, 02:35:57 AM 
Started by y eye - Last post by y eye
If LibreOffice appears at all familiar, it should come as no surprise that the suite has roots in OpenOffice. In fact it is a community lead branch of the same office suite that has been developed by The Document Foundation. You may well wonder why there is a need for different branches of the same office suite - the main reason is that it enables broader changes and additions to be made to the suite

As things stand at the moment, LibreOffice Productivity Suite is not very different to OpenOffice. The main focus of the early releases of the suite are tidying up and optimising existing code before switching to adding new features and options.

Existing users of OpenOffice will feel immediately at home, as all of the familiar components of the suite can be found here in LibreOffice. The suite comprises a word processor, spreadsheet, drawing tool, database and numerous other components. Files can be saved in the suite's own native format, or in formats that are compatible with the likes of Microsoft Office.

As an Office suite is almost essential for most computer users, coupled with the fact that commercial suites tend to be somewhat expensive, there is nothing to be lost in trying out a free alternative. LibreOffice, just like its stable mate OpenOffice, is a very competent tool which could easily cater for your home office or business needs.

Verdict:
LibreOffice proves that the fact that software is free does not mean that it is poor quality - this is a recommended alternative to Microsoft Office.
http://www.downloadcrew.com/article/18332-libreoffice_productivity_suite

 38 
 on: January 26, 2011, 01:39:29 AM 
Started by y eye - Last post by y eye
EUV-litho-era-begins--but-is-it-ready--?

This thread began two years ago. At the time HP was first to take up the Ultra Violet Lithography banner and ASML took the lead building Lithography machinery.
The subject is highly technical and often deep into Theory but it is understandable and very exciting to follow the successes as we march onwards and upwards towards 22nm and beyond.

We have recently witnessed failures by TSMC at 40nm and Intel's success at 32nm. Glofo and TSMC are attempting to skip processes, 32nm and 22nm, in the race to 20nm.
The Gate First scenario has been outperformed by Gate Last at the 32 nanometer high-k metal gate chips by Intel: http://www.youtube.com/watch?v=Oek4ilSsv5M

From   http://www.brion.com/ we can see the documented progress.
Brion is a Robot, an on the floor real time controlling programing Robot.
All of the solutions we have talked about and the ones you can observe at brion.com were and are solved by Brion "The father of the Golden Orb".





Is Lithography ready?
 
The R&D costs to proceed are thinning the players to a few.
They are going for 22nm and beyond with UV Lithography.
   
Editor Note

450-mm simmers

Stop the presses: Semiconductor manufacturers will not be moving to 450-mm wafers for production as quickly as some had targeted.
Prior to the recession, some hoped that 450-mm would be in production by 2015 or 2016. Now, according to IC Insights analyst Trevor Yancey,
450-mm production won't happen until at least 2017 or 2018. Even that seems optimistic.

As has been repeatedly stated here and elsewhere, chip equipment vendors invested big in 300-mm equipment development prior to the last wafer transition,
and they were left holding the bag when a downturn hit and chip makers held off on buying the new tools.
They are understandably squeamish about the possibility of going through all of that again. While the usual suspects—Intel,
Samsung and TSMC—push for 450-mm, equipment vendors realize that these firms are the only potential customers for the tools,
at least initially, and quite possibly ever. But according to VLSI Research CEO G. Dan Hutcheson, equipment makers are actually starting to come around,
prompting "a lot of activity going on in the back channel around 450-mm to indicate that some big news will break next year."
Possibly look for a smattering of 450-mm tool news at this year's Semicon West. Intel is pushing hard for the gear,
but the big question lingers: Who will pay for all of the R&D?
Editor Note: 450-mm simmers and fab schedule slips
 

Analyst: Intel's 450mm not ready for prime-time
Posted: 29 Oct 2010
Keywords: 450-mm wafer fab forecast

As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities
for 22nm production at a total investment of between Rs.28,017.62 crore ($6 billion) and Rs.37,356.82 crore ($8 billion).
The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said.
The new development fab in Oregon, to be known as D1X, is slated for R&D start-up in 2013. ''So what do make of this?
We offer two key takeaways and then walk through some additional thoughts on 450mm, as D1X is likely to be 450mm capable,
said C.J. Muse, an analyst with Barclays Capital, in a report.

''With respect to Intel's D1X, our checks reveal that it would likely be 450mm ready (again, 450mm READY), but not yet 450mm capable,'' Muse said.
''What does that mean? It means that it would be facilitized with taller ceilings, enhanced clean room capability
(capable of pumping out a larger volume and filling it with particle free air), and with pedestals able to support and contain any vibration from bigger and heavier tools.
The point being - this does not mean 450mm is ready for prime time, rather Intel is maximising optionality.''

Still, is 450mm ready? No, said Muse. ''We believe 450mm is going to happen, but is likely to involve funding from chip companies.
Equipment companies will not foot the bill alone this time. And it is not ready for prime time, in our view. Not at all, our checks suggest unequivocally,'' he said.

According to Muse-and Sematech-there is much work to be done in 450mm. Chip-consortium Sematech is leading the charge in 450mm, it was noted.

According to Muse, here's what ready for 450mm: 1. requirement guidelines; 2. early design; 3. early prototypes; 4. interoperability test bed; 5. mechanical wafer bank;
6. technology intercept node defined; 7. single crystal wafer bank; and 8. equipment performance metrics.

Here's what is not done: 9. metrology and process equipment development; 10. equipment prototypes; 11. equipment demos; and 12. actual equipment readiness.

Plus, many equipment vendors are reluctant to devise 450mm gear, because it is too expensive and there is no return.
Only a handful of chip makers will build 450mm fabs. Intel, TSMC and Samsung are the few that are pushing for 450mm now.

Cost is the big issue. ''In addition, work at ISMI Sematech suggests, for beam tools like litho, implant and metrology,
the throughput is a function of the area the beam can scan in an hour, the multiplier from 300mm to 450mm is not 2.25+ (2.25+ some additional gain due to edge gains, i.e., more dies can be squeezed in)
but just 1.24 on average and actually just 1.18 for litho,'' Muse said.

''Also, during the same time, the litho industry faces the challenge of making EUV lithography work and overall the semiconductor faces obstacles like a new gate structure,
new materials. So, just yet, we believe it is difficult to see 450mm happening,'' he added.

- Mark LaPedus
EE Times


...01Feb11...

EUV litho era begins, but is it ready?
Mark LaPedus 2/1/2011
 SAN JOSE, Calif.—ASML Holding NV has recently shipped the world's first ''pre-production'' extreme ultraviolet (EUV) lithography tool to a customer, reportedly Samsung Electronics Co. Ltd., sources said.
http://www.eetimes.com/electronics-news/4212771/EUV-litho-era-begins--but-is-it-ready--?cid=NL_EETimesDaily



...07Feb11...

Keywords: EUV lithography tool EUV throughput ASML's second-generation EUV systems

First EUV tool ships amid power, tech concerns
Posted: 07 Feb 2011

Samsung Electronics Co. Ltd was reported to have purchased the world's first "pre-production" extreme ultraviolet (EUV) lithography tool from ASML Holding NV.
However, what experts are more concerned about is whether EUV is ready for prime time. To date, the power source and other technologies for EUV have yet to be finalized.
Sources also revealed that the throughput still poses challenges as the tool only manages 10 to 12 wafers per hour, a figure way below that required by high-volume production fabs.

In its recent results, ASML said it shipped the first of its second-generation EUV systems, the NXE:3100, to an undisclosed customer manufacturing site.
The NXE:3100 will offer a resolution of 27nm with a numerical aperture (NA) of 0.25, overlay of less than 4.5nm and a throughput of 60 wafers per hour.

A "pre-production" EUV scanner from ASML runs about 60 million Euros, or $86.9 million, per unit. Some say that price tag could hit $125 million when ASML ships a production-worthy tool.

http://www.eetasia.com/ART_8800633925_480200_NT_24e02b7b.HTM?click_from=8800071881,9949906143,2011-02-07,EEOL,ARTICLE_ALERT


...10Feb11...






http://www.asml.com/doclib/press/asml_20100812_Images_Summer_Edition-final.pdf



...11Feb11

February 09, 2011                                      
Researchers at Harvard and MITRE produce world’s first programmable nanoprocessor

Nanowire tiles can perform arithmetic and logical functions and are fully scalable

Source: CONTACT: Caroline Perry, 617-496-3815   http://www.seas.harvard.edu/news-events/press-releases/nanoprocessor
Cambridge, Mass. – February 9, 2011 –

The work was enabled by advances in the design and synthesis of nanowire building blocks.
These nanowire components now demonstrate the reproducibility needed to build functional electronic circuits,
and also do so at a size and material complexity difficult to achieve by traditional top-down approaches.

Moreover, the tiled architecture is fully scalable, allowing the assembly of much larger and ever more functional nanoprocessors.

“For the past 10 to 15 years, researchers working with nanowires, carbon nanotubes,
and other nanostructures have struggled to build all but the most basic circuits,
in large part due to variations in properties of individual nanostructures,” says Lieber,
the Mark Hyman Professor of Chemistry. “We have shown that this limitation can now be overcome and are excited about prospects of
exploiting the bottom-up paradigm of biology in building future electronics.”

An additional feature of the advance is that the circuits in the nanoprocessor operate using very little power, even allowing for their miniscule size,
because their component nanowires contain transistor switches that are “nonvolatile.”

This means that unlike transistors in conventional microcomputer circuits, once the nanowire transistors are programmed,
they do not require any additional expenditure of electrical power for maintaining memory.

“Because of their very small size and very low power requirements, these new nanoprocessor circuits are building blocks that can control and
enable an entirely new class of much smaller, lighter weight electronic sensors and consumer electronics,” says co-author Shamik Das,
the lead engineer in MITRE’s Nanosystems Group.


“This new nanoprocessor represents a major milestone toward realizing the vision of a nanocomputer that was first articulated more than 50 years ago by
physicist Richard Feynman,” says James Ellenbogen, a chief scientist at MITRE.

Co-authors on the paper included four members of Lieber’s lab at Harvard: Hao Yan (Ph.D. '10), SungWoo Nam (Ph.D. '10), Yongjie Hu (Ph.D. '10),
and doctoral candidate Hwan Sung Choe, as well as collaborators at MITRE.

...11Feb11...

Lab Partnership Develops Programmable Nanoprocessor
By RADHIKA JAIN, CRIMSON STAFF WRITER http://www.thecrimson.com/article/2011/2/11/researchers-system-nano-lab/
Published: Friday, February 11, 2011


###


...11April11...

                    

  http://www.eetasia.com/ART_8800640001_480200_NT_60b931db.HTM?click_from=8800077253,9949906143,2011-04-11,EEOL,ARTICLE_ALERT


...16May11...


Business News
TSMC joins Sematech, cites 450-mm R&D
May 16, 2011 | Peter Clarke | 222907379   http://www.electronics-eetimes.com/en/tsmc-joins-sematech-cites-450-mm-r-d.html?cmp_id=7&news_id=222907379&vID=662#
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced
that it has decided to join Sematech, the international consortium
of semiconductor manufacturers, as a core member.

TSMC (Hsinchu, Taiwan) has long been a core member at a rival research collaboration, hosted by IMEC (Leuven, Belgium),
where it works with most of the world's leading semiconductor companies. The company has now opted to also join Sematech.

TSMC said it would collaborate on semiconductor research and development for IC process technologies for the 20-nm generation and beyond,
including extreme ultra-violet (EUV) lithography, 3-D interconnects, metrology, novel materials and device structures,
and to develop critical infrastructure vital for next-generation manufacturing, including the transition to the 450-mm wafer size for production.

Sematech's other core members include GlobalFoundries, Hewlett Packard, IBM, Intel, Samsung, UMC,
and the College of Nanoscale Science and Engineering (CNSE) at Albany, New York.

"This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions,
with TSMC’s position as an industry leader in advanced technology development and manufacturing," said Jack Sun, CTO at TSMC, in a statement.

"TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies,"
said Dan Armbrust, president and CEO of Sematech.


...21June11...

The 28nm node is TSMC's most energy-efficient and high-performance process technology family.

The 28nm Low Power (LP) process was the first in the foundry sector to reach production.
The 28 High Performance (HP) is the first high-k metal gate process technology and features superior speed and performance.
The 28 High Performance, Low Power (HPL) is our lowest-leakage process and adopts the same gate stack
as found in the HP technology while meeting more stringent low leakage requirements. The 28 High Performance,
Mobile (HPM) process is specifically designed for mobile computing, providing for higher performance than 28HP with leakage similar to 28LP.
        
         http://www.tsmc.com/advanced_technology_AD/28nm.htm

         http://www.tsmc.com/english/dedicatedFoundry/manufacturing/gigafab.htm


...23June...

SuVolta creates new transistor option for 20nm
Ron Wilson  http://www.eetimes.com/design/eda-design/4217178/SuVolta-creates-new-transistor-option-for-20nm?cid=NL_Embedded&Ecosystem=embedded
6/22/2011 1:13 PM EDT

SuVolta, a startup process IP company with deep roots in device design and modeling, has developed a new transistor that could challenge finFETs and SoI at 20nm and below,
as the conventional planar MOSFET begins to run out of steam. Built in a conventional process but offering channel mobility approaching that of intrinsic silicon,
the PowerShrink technology raises the prospect of power savings on the order of a factor of five, lower operating voltages, vastly reduced threshold variations, and more to come.

The key to the technology, according to SuVolta CTO Scott Thompson, is that the transistor is in every way like any other planar MOSFET—with one huge difference.
The PowerShrink device has a shallow, updoped channel that operates in deeply-depleted mode. In this sense, the device is more like a fully-depleted SoI (FDSoI) MOSFET.
But the SoI device requires a special FDSoI wafer that has only a 10-15nm layer of silicon over a buried layer of oxide.

In contrast, SuVolta’s device creates the same ultra-thin 5nm-thick channel by implanting few-atoms-thick dopant layers beneath the channel.
These implants apparently form a buried junction that, when properly biased, depletes the thin active region of the channel almost completely.
The result is a device that exhibits the very low leakage, very high mobility, and very low threshold variation of FDSoI, but on a conventional wafer and process.









 39 
 on: January 22, 2011, 09:12:26 AM 
Started by y eye - Last post by y eye
Peter Clarke

1/20/2011 http://www.eetimes.com/electronics-news/4212333/AMD-aims-most-capable-processor-at-embedded?cid=NL_EETimesWIR

The Embedded G-Series includes 1 or 2 Bobcat x86 cores with 1-Mbyte of L2 cache and 64-bit floating-point unit.
It runs at clock frequencies of up to 1.6-Ghz and consumes of the order of 10 to 20-W.
Chip package occupies a 890 square millimeter footprint and includes an AMD Fusion I/O controller and hub IC.

AMD said it expects the Embedded-G to find use in graphics-intensive applications such as digital signage, internet-ready set top boxes, mobile and desktop thin clients,
casino gaming machines, point-of-sale kiosks, and small form factor PCs, as well as numerous single board computers (SBCs).

AMD has prepared multiple BIOS options for the Embedded-G, support for various Microsoft Windows, Linux, and real-time operating systems,
and an integrated OpenCL programming environment, and source-level debug tools.


 40 
 on: January 22, 2011, 07:55:28 AM 
Started by y eye - Last post by y eye
Express News Fx57 21January2011

http://www.donanimhaber.com/ekran-karti/haberleri/AMD-yeni-amiral-gemisi-Radeon-HD-6990i-gosterdi.htm



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