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31  Welcome to Fudzilla Forum / General Discussion / 22nm and beyond: News & Analysis on: January 26, 2011, 01:39:29 AM

This thread began two years ago. At the time HP was first to take up the Ultra Violet Lithography banner and ASML took the lead building Lithography machinery.
The subject is highly technical and often deep into Theory but it is understandable and very exciting to follow the successes as we march onwards and upwards towards 22nm and beyond.

We have recently witnessed failures by TSMC at 40nm and Intel's success at 32nm. Glofo and TSMC are attempting to skip processes, 32nm and 22nm, in the race to 20nm.
The Gate First scenario has been outperformed by Gate Last at the 32 nanometer high-k metal gate chips by Intel: http://www.youtube.com/watch?v=Oek4ilSsv5M

From   http://www.brion.com/ we can see the documented progress.
Brion is a Robot, an on the floor real time controlling programing Robot.
All of the solutions we have talked about and the ones you can observe at brion.com were and are solved by Brion "The father of the Golden Orb".

Is Lithography ready?
The R&D costs to proceed are thinning the players to a few.
They are going for 22nm and beyond with UV Lithography.
Editor Note

450-mm simmers

Stop the presses: Semiconductor manufacturers will not be moving to 450-mm wafers for production as quickly as some had targeted.
Prior to the recession, some hoped that 450-mm would be in production by 2015 or 2016. Now, according to IC Insights analyst Trevor Yancey,
450-mm production won't happen until at least 2017 or 2018. Even that seems optimistic.

As has been repeatedly stated here and elsewhere, chip equipment vendors invested big in 300-mm equipment development prior to the last wafer transition,
and they were left holding the bag when a downturn hit and chip makers held off on buying the new tools.
They are understandably squeamish about the possibility of going through all of that again. While the usual suspects—Intel,
Samsung and TSMC—push for 450-mm, equipment vendors realize that these firms are the only potential customers for the tools,
at least initially, and quite possibly ever. But according to VLSI Research CEO G. Dan Hutcheson, equipment makers are actually starting to come around,
prompting "a lot of activity going on in the back channel around 450-mm to indicate that some big news will break next year."
Possibly look for a smattering of 450-mm tool news at this year's Semicon West. Intel is pushing hard for the gear,
but the big question lingers: Who will pay for all of the R&D?
Editor Note: 450-mm simmers and fab schedule slips

Analyst: Intel's 450mm not ready for prime-time
Posted: 29 Oct 2010
Keywords: 450-mm wafer fab forecast

As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities
for 22nm production at a total investment of between Rs.28,017.62 crore ($6 billion) and Rs.37,356.82 crore ($8 billion).
The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said.
The new development fab in Oregon, to be known as D1X, is slated for R&D start-up in 2013. ''So what do make of this?
We offer two key takeaways and then walk through some additional thoughts on 450mm, as D1X is likely to be 450mm capable,
said C.J. Muse, an analyst with Barclays Capital, in a report.

''With respect to Intel's D1X, our checks reveal that it would likely be 450mm ready (again, 450mm READY), but not yet 450mm capable,'' Muse said.
''What does that mean? It means that it would be facilitized with taller ceilings, enhanced clean room capability
(capable of pumping out a larger volume and filling it with particle free air), and with pedestals able to support and contain any vibration from bigger and heavier tools.
The point being - this does not mean 450mm is ready for prime time, rather Intel is maximising optionality.''

Still, is 450mm ready? No, said Muse. ''We believe 450mm is going to happen, but is likely to involve funding from chip companies.
Equipment companies will not foot the bill alone this time. And it is not ready for prime time, in our view. Not at all, our checks suggest unequivocally,'' he said.

According to Muse-and Sematech-there is much work to be done in 450mm. Chip-consortium Sematech is leading the charge in 450mm, it was noted.

According to Muse, here's what ready for 450mm: 1. requirement guidelines; 2. early design; 3. early prototypes; 4. interoperability test bed; 5. mechanical wafer bank;
6. technology intercept node defined; 7. single crystal wafer bank; and 8. equipment performance metrics.

Here's what is not done: 9. metrology and process equipment development; 10. equipment prototypes; 11. equipment demos; and 12. actual equipment readiness.

Plus, many equipment vendors are reluctant to devise 450mm gear, because it is too expensive and there is no return.
Only a handful of chip makers will build 450mm fabs. Intel, TSMC and Samsung are the few that are pushing for 450mm now.

Cost is the big issue. ''In addition, work at ISMI Sematech suggests, for beam tools like litho, implant and metrology,
the throughput is a function of the area the beam can scan in an hour, the multiplier from 300mm to 450mm is not 2.25+ (2.25+ some additional gain due to edge gains, i.e., more dies can be squeezed in)
but just 1.24 on average and actually just 1.18 for litho,'' Muse said.

''Also, during the same time, the litho industry faces the challenge of making EUV lithography work and overall the semiconductor faces obstacles like a new gate structure,
new materials. So, just yet, we believe it is difficult to see 450mm happening,'' he added.

- Mark LaPedus
EE Times


EUV litho era begins, but is it ready?
Mark LaPedus 2/1/2011
 SAN JOSE, Calif.—ASML Holding NV has recently shipped the world's first ''pre-production'' extreme ultraviolet (EUV) lithography tool to a customer, reportedly Samsung Electronics Co. Ltd., sources said.


Keywords: EUV lithography tool EUV throughput ASML's second-generation EUV systems

First EUV tool ships amid power, tech concerns
Posted: 07 Feb 2011

Samsung Electronics Co. Ltd was reported to have purchased the world's first "pre-production" extreme ultraviolet (EUV) lithography tool from ASML Holding NV.
However, what experts are more concerned about is whether EUV is ready for prime time. To date, the power source and other technologies for EUV have yet to be finalized.
Sources also revealed that the throughput still poses challenges as the tool only manages 10 to 12 wafers per hour, a figure way below that required by high-volume production fabs.

In its recent results, ASML said it shipped the first of its second-generation EUV systems, the NXE:3100, to an undisclosed customer manufacturing site.
The NXE:3100 will offer a resolution of 27nm with a numerical aperture (NA) of 0.25, overlay of less than 4.5nm and a throughput of 60 wafers per hour.

A "pre-production" EUV scanner from ASML runs about 60 million Euros, or $86.9 million, per unit. Some say that price tag could hit $125 million when ASML ships a production-worthy tool.





February 09, 2011                                      
Researchers at Harvard and MITRE produce world’s first programmable nanoprocessor

Nanowire tiles can perform arithmetic and logical functions and are fully scalable

Source: CONTACT: Caroline Perry, 617-496-3815   http://www.seas.harvard.edu/news-events/press-releases/nanoprocessor
Cambridge, Mass. – February 9, 2011 –

The work was enabled by advances in the design and synthesis of nanowire building blocks.
These nanowire components now demonstrate the reproducibility needed to build functional electronic circuits,
and also do so at a size and material complexity difficult to achieve by traditional top-down approaches.

Moreover, the tiled architecture is fully scalable, allowing the assembly of much larger and ever more functional nanoprocessors.

“For the past 10 to 15 years, researchers working with nanowires, carbon nanotubes,
and other nanostructures have struggled to build all but the most basic circuits,
in large part due to variations in properties of individual nanostructures,” says Lieber,
the Mark Hyman Professor of Chemistry. “We have shown that this limitation can now be overcome and are excited about prospects of
exploiting the bottom-up paradigm of biology in building future electronics.”

An additional feature of the advance is that the circuits in the nanoprocessor operate using very little power, even allowing for their miniscule size,
because their component nanowires contain transistor switches that are “nonvolatile.”

This means that unlike transistors in conventional microcomputer circuits, once the nanowire transistors are programmed,
they do not require any additional expenditure of electrical power for maintaining memory.

“Because of their very small size and very low power requirements, these new nanoprocessor circuits are building blocks that can control and
enable an entirely new class of much smaller, lighter weight electronic sensors and consumer electronics,” says co-author Shamik Das,
the lead engineer in MITRE’s Nanosystems Group.

“This new nanoprocessor represents a major milestone toward realizing the vision of a nanocomputer that was first articulated more than 50 years ago by
physicist Richard Feynman,” says James Ellenbogen, a chief scientist at MITRE.

Co-authors on the paper included four members of Lieber’s lab at Harvard: Hao Yan (Ph.D. '10), SungWoo Nam (Ph.D. '10), Yongjie Hu (Ph.D. '10),
and doctoral candidate Hwan Sung Choe, as well as collaborators at MITRE.


Lab Partnership Develops Programmable Nanoprocessor
By RADHIKA JAIN, CRIMSON STAFF WRITER http://www.thecrimson.com/article/2011/2/11/researchers-system-nano-lab/
Published: Friday, February 11, 2011






Business News
TSMC joins Sematech, cites 450-mm R&D
May 16, 2011 | Peter Clarke | 222907379   http://www.electronics-eetimes.com/en/tsmc-joins-sematech-cites-450-mm-r-d.html?cmp_id=7&news_id=222907379&vID=662#
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced
that it has decided to join Sematech, the international consortium
of semiconductor manufacturers, as a core member.

TSMC (Hsinchu, Taiwan) has long been a core member at a rival research collaboration, hosted by IMEC (Leuven, Belgium),
where it works with most of the world's leading semiconductor companies. The company has now opted to also join Sematech.

TSMC said it would collaborate on semiconductor research and development for IC process technologies for the 20-nm generation and beyond,
including extreme ultra-violet (EUV) lithography, 3-D interconnects, metrology, novel materials and device structures,
and to develop critical infrastructure vital for next-generation manufacturing, including the transition to the 450-mm wafer size for production.

Sematech's other core members include GlobalFoundries, Hewlett Packard, IBM, Intel, Samsung, UMC,
and the College of Nanoscale Science and Engineering (CNSE) at Albany, New York.

"This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions,
with TSMC’s position as an industry leader in advanced technology development and manufacturing," said Jack Sun, CTO at TSMC, in a statement.

"TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies,"
said Dan Armbrust, president and CEO of Sematech.


The 28nm node is TSMC's most energy-efficient and high-performance process technology family.

The 28nm Low Power (LP) process was the first in the foundry sector to reach production.
The 28 High Performance (HP) is the first high-k metal gate process technology and features superior speed and performance.
The 28 High Performance, Low Power (HPL) is our lowest-leakage process and adopts the same gate stack
as found in the HP technology while meeting more stringent low leakage requirements. The 28 High Performance,
Mobile (HPM) process is specifically designed for mobile computing, providing for higher performance than 28HP with leakage similar to 28LP.



SuVolta creates new transistor option for 20nm
Ron Wilson  http://www.eetimes.com/design/eda-design/4217178/SuVolta-creates-new-transistor-option-for-20nm?cid=NL_Embedded&Ecosystem=embedded
6/22/2011 1:13 PM EDT

SuVolta, a startup process IP company with deep roots in device design and modeling, has developed a new transistor that could challenge finFETs and SoI at 20nm and below,
as the conventional planar MOSFET begins to run out of steam. Built in a conventional process but offering channel mobility approaching that of intrinsic silicon,
the PowerShrink technology raises the prospect of power savings on the order of a factor of five, lower operating voltages, vastly reduced threshold variations, and more to come.

The key to the technology, according to SuVolta CTO Scott Thompson, is that the transistor is in every way like any other planar MOSFET—with one huge difference.
The PowerShrink device has a shallow, updoped channel that operates in deeply-depleted mode. In this sense, the device is more like a fully-depleted SoI (FDSoI) MOSFET.
But the SoI device requires a special FDSoI wafer that has only a 10-15nm layer of silicon over a buried layer of oxide.

In contrast, SuVolta’s device creates the same ultra-thin 5nm-thick channel by implanting few-atoms-thick dopant layers beneath the channel.
These implants apparently form a buried junction that, when properly biased, depletes the thin active region of the channel almost completely.
The result is a device that exhibits the very low leakage, very high mobility, and very low threshold variation of FDSoI, but on a conventional wafer and process.

32  Hardware / Processors - CPU / AMD aims 'most capable' processor at embedded on: January 22, 2011, 09:12:26 AM
Peter Clarke

1/20/2011 http://www.eetimes.com/electronics-news/4212333/AMD-aims-most-capable-processor-at-embedded?cid=NL_EETimesWIR

The Embedded G-Series includes 1 or 2 Bobcat x86 cores with 1-Mbyte of L2 cache and 64-bit floating-point unit.
It runs at clock frequencies of up to 1.6-Ghz and consumes of the order of 10 to 20-W.
Chip package occupies a 890 square millimeter footprint and includes an AMD Fusion I/O controller and hub IC.

AMD said it expects the Embedded-G to find use in graphics-intensive applications such as digital signage, internet-ready set top boxes, mobile and desktop thin clients,
casino gaming machines, point-of-sale kiosks, and small form factor PCs, as well as numerous single board computers (SBCs).

AMD has prepared multiple BIOS options for the Embedded-G, support for various Microsoft Windows, Linux, and real-time operating systems,
and an integrated OpenCL programming environment, and source-level debug tools.

33  Hardware / Graphics Cards / AMD news showed flagship Radeon HD 6990'ı on: January 22, 2011, 07:55:28 AM
Express News Fx57 21January2011


34  Welcome to Fudzilla Forum / Discussion about Articles / Re: Editor's Desk: Sylvie and Tegra 2 on: January 22, 2011, 01:11:09 AM
You should be OK.
I will bring the thread over here for your read so that you will not have to register to Maingear. :)y
35  Software / Games / Exclusive: Duke Nukem Forever Has A Release Date, New Trailer on: January 21, 2011, 10:47:47 PM

news http://www.gameinformer.com/b/news/archive/2011/01/21/exclusive-duke-nukem-forever-has-a-release-date.aspx
by Jeff Cork on January 21, 2011


36  Hardware / Processors - CPU / The Intel® Core™ processor family lives... kind-of... well... sorta on: January 17, 2011, 09:46:10 AM
 i3, i5 and i7 are the designations for Intel's Core CPUs and are
followed by four numbers preceded by a 2 and may end in a letter (F,S or T).

Release #1: Sandy Bridge CPU has come and gone and the NDA is still on.
 Sandy Bridge as a name/designation is no longer used for The Intel® Core™ processor family.  

Note: There are two Intel Core i7 26XX CPUs and they are:
The advantages of the Core i7 2600 are enhanced Read Write SSDs, Syncing and Video Codec speed increases.
The advantage of the Core i7 2600K is unlocking for Overclocking; however, there are none of the advantages of the 2600.



The Inpai and Expreview Articles have comprehensive benchmarks and reports on the Z68 Chipset.
Most interesting are massive overclocking, SSD read, write improvements, syncing and video encoding acceleration.
"Made official just recently, the Z68 chipset comes as a hybrid between the P67 and the H67
and was designed in order to allow for overclocking Sandy Bridge CPUs while using the integrated graphics."

01. Intel Quick Sync HD video transcoding acceleration of Comparative
2011-01-13 17:37
02. SNB series of 11 bombs, Intel Quick Sync transcoding acceleration test
2011-01-12 17:00
03. SNB series of eight bomb, Sandy Bridge processor synchronization evaluation
2011-01-05 09:00
These topics discuss new additions to some of the i3, i5 and i7 Intel CPUs and may be available without the Intel to be released Z68 Chipset.
Of the new instrument: http://www.expreview.com/13290-1.html

HD100 has been changed to HD2000
HD200 has been changed to HD3000

This is as good a place to begin the viewing as any:  http://en.inpai.com.cn/doc/enshowcont.asp?id=7949&pageid=7742
On the upper right hand side of the page are additional articles.

PAGE15: Final Words  http://en.inpai.com.cn/doc/enshowcont.asp?id=7949&pageid=7749  

Related reports:
An Inpai writer stated that a Software Lucid Logic Program makes it possible
to combine Radeon and nVidia Graphics Cards on the same MotherBoard.
It was not stated which MotherBoards have lucid logic embedded but probably MSI.

More on Hydra Here: ...31Dec10...  http://www.lucidlogix.com/download/product-adventure2800_2_3991769098.pdf

Zol.cn has a MSI Z68 MotherBoard pictured.  

MSI Z68 Mother Board: MSI Intel Z68 Motherboard photos
January 10th, 2011  http://news.softpedia.com/newsImage/MSI-Intel-Z68-Motherboard-Also-Poses-for-the-Camera-4.jpg/

                                                                    How to ID a unlocked Intel Core CPU:

How to overclock a non Z68 Chipset Mother Board:
Plug in a Graphics Card... walla massive overclocking at your fingertips.Smiley
No SSD updates or Syncing or accelerated video coding and decoding but what the hey?

Why: The P67 and H67 Chipset Mother Boards are designed to overclock in the absence of the Z68 Hybrid Chipset.

 P67 'OC' Bioses (internal PLL overvoltage fix): http://hwbot.org/forum/showthread.php?t=15952


Intel Will Work On Better Linux Timing For Ivy Bridge
Posted by Michael Larabel on January 04, 2011
Intel though admits it could have done better with its Linux launch support. In one of our active threads in the Phoronix Forums, Jesse Barnes admits they sort of messed up with the Sandy Bridge launch. Jesse is one of the open-source Linux developers at Intel responsible for the support upbringing and ongoing driver development across their DRM / Mesa / DDX.
No, this is our job, and we blew it for Sandy Bridge. We're supposed to do development well ahead of product release, and make sure distros include the necessary code to get things working (we have separate teams to do development and aid distros in backporting, though most of them can handle it by themselves these days).

I could give you all sorts of explanations as to why this is (Sandy Bridge is a big architectural change, we made some mistakes in defining our development milestones, and we didn't work hard enough to get our changes backported), but really there's no excuse. Fortunately we've learned from this and are giving ourselves more time and planning better for Sandy Bridge's successor, Ivy Bridge.

37  Welcome to Fudzilla Forum / General Discussion / Licence to speed on: January 06, 2011, 09:23:05 AM
Rambus files new round of law suits: 01Dec10


...15Feb11... http://files.shareholder.com/downloads/RMBS/1170663755x0x442152/AC7E2DC3-8D6F-4B92-854B-9944849992F3/2011-02-15_Order_relating_FSL_LSI_MTK_NV_ST.pdf

ITC Investigation is complete... New Trial Judge appointed.

...25Jan11... Order Staying Action Pending Resolution of ITC Investigation - nVidia   01/25/2011        66.4 KB

Stay updated from Litigation Page: Litigation Update... http://investor.rambus.com/litigation.cfm  ...18Feb11...
                     Be sure to: Click on " Litigation Update " to update the page!

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~... End of Updates...~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~Rambus files new round of law suits: 01Dec10~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Some of you may not be aware that there was a first round of court charges, settlements and havoc that resulted.
One result that was not well recorded was the failure of nVidia Graphics after the responsibility of guilt and theft was found.
Could this be a return to those events? Dr. Bill Dally was involved in the original charges by Rambus.  








This time around the ARM Cortex series A Processors may be influenced by Court results, Rambus vs. nVidia.
The ARM Cortex A15 is reported to be the "Atom Smasher to end all Atom smashing".



... ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ...

Does History repeat... Some say it does.

I believe a ban will be placed on nVidia Motherboards and some Graphics Cards just as last time they and Rambus tangled over patent and intellectual property rights. That is what spoiled Fermi and half a dozen motherboards.

The blockage of imports to the USA should begin on 15Feb11, or when Rambus wins their case.

It is interesting to note that the Rambus decision against nVidia spelled the silencing of the Shills and halted sale of parts, that was good news; however, resulting insurance battles over bumpgate and the questionable sale and resale of parts and pre-ordered parts...  resulted in decline of sales and the demise of Graphics Card Manufacturers... It will be interesting to watch the shills as they jump ship from Company to Company and Forum to Forum. Nothing too serious just a little bit of virtual cleansing. I would sure like to hear XFX's take on the new Rambus charges.


... note: This section reports determination of first litigation...

July 26, 2010
ITC Issues Notice of Final Determination in Rambus Matter Regarding NVIDIA Products

Limited Exclusion Order and Cease and Desist Orders to Be Issued   http://investor.rambus.com/releasedetail.cfm?ReleaseID=492444  

... end of note...


December 1, 2010
Rambus Files ITC Complaint against Broadcom, Freescale, LSI, MediaTek, NVIDIA and STMicroelectronics

Patent infringement pursued against same companies in U.S. District Court

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies, today announced it has filed a complaint with the United States International Trade Commission (ITC) requesting the commencement of an investigation pertaining to products from Broadcom Corporation, Freescale Semiconductor, Inc., LSI Corporation, MediaTek Inc., NVIDIA Corporation and STMicroelectronics N. V. The complaint seeks an exclusion order barring the importation, sale for importation, or sale after importation of products from Broadcom, Freescale, LSI, NVIDIA and STMicroelectronics that infringe certain patents from the Dally1 family of patents, and of products from Broadcom, Freescale, LSI, MediaTek and STMicroelectronics that infringe certain patents from the Barth family of patents. In an earlier investigation requested by Rambus, the ITC found that these same Barth patents were valid and infringed by NVIDIA products, and issued an exclusion order in July of this year.






  Date: 6th Dec 2010

Rambus says for the Dally patents, the accused semiconductor products from these companies include ones that incorporate PCI Express, certain Serial ATA, certain Serial Attached SCSI (SAS), and DisplayPort interfaces. In the case of the Barth patents, the accused semiconductor products include ones that incorporate DDR, DDR2, DDR3, mobile DDR, LPDDR, LPDDR2, and GDDR3 memory controllers. Accused semiconductor products in the complaint include graphics processors, media processors, communications processors, chip sets and other logic integrated circuits (ICs).

Rambus also filed separate actions for patent infringement against Broadcom, Freescale, LSI, MediaTek and STMicroelectronics in the United States District Court for the Northern District of California. The lawsuits allege that semiconductor products with certain memory controllers and/or serial links from the above companies infringe certain patents from the Farmwald-Horowitz, Barth, and Dally patent families. In the case of MediaTek, only infringement of the Barth and Farmwald-Horowitz patents for certain memory controllers is alleged. Rambus also filed an action in the United States District Court for the Northern District of California against NVIDIA for infringement of certain Dally patents. The categories of accused semiconductor products in the District Court complaints include the same categories accused in the ITC complaint, as well as SDR memory controllers. Rambus is seeking injunctive relief barring the infringement, contributory infringement, and inducement to infringe the patents, as well as monetary damages.

Rambus is the exclusive licensee for the Dally family of patents which are owned by Massachusetts Institute of Technology. This license was assigned to Rambus as a part of its 2003 acquisition of technology and IP from Velio Communications, a company founded by Dr. William Dally.


Litigation Update Here: http://investor.rambus.com/litigation.cfm ...... http://investor.rambus.com/  
View all releases,  Investor Relations Here:  http://investor.rambus.com/releases.cfm?ReleasesType=Legal&Year=  

... ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ...


   LICENSE TO SPEED  Rambus' Wall of Patents

Speeding without a licence  


" The ITC will set a date for completing the investigation within 45 days of its institution and the decision is set to be ratified, or not, within 60 days of a decision being handed down."  

Litigation updates: [Url=http://investor.rambus.com/litigation.cfm?CategoryID=4963]http://investor.rambus.com/litigation.cfm?CategoryID=4963

                                                                       two 8-pin power connectors:
                                                                                     evga's to be released, unlicenced dual GPU Graphics Card.


News flash: Events & Presentations public notice
                     Q4 2010 Rambus Inc. Conference Call

              Jan 27, 2011 at 2:00 PM PT http://investor.rambus.com/eventdetail.cfm



May 13, 2011
Rambus Receives Decisions from Court of Appeals for the Federal Circuit: http://investor.rambus.com/releasedetail.cfm?ReleaseID=577390

Hynix case final judgment vacated and case remanded;

In Micron case, Court affirmed Rambus spoliated documents, dismissal sanction vacated and case remanded

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies, today announced that the Court of Appeals for the Federal Circuit (CAFC) has issued its decisions in cases with Hynix Semiconductor (000660.KS) and Micron Technology Inc. (Nasdaq:MU). In the ruling in the Micron case, the CAFC affirmed the district court's determination that Rambus spoliated documents, but vacated the court's dismissal sanction and remanded the case for further consideration by the U.S. District of Delaware Court. In its ruling in the Hynix case, the CAFC vacated the district court's spoliation findings where it had found that Rambus had not spoliated documents. The CAFC further vacated the court's final judgment, and remanded the case to the U.S. District Court for the Northern District of California (NDCA) for reconsideration.

"We are very disappointed with the decisions in these cases," said Thomas Lavelle, senior vice president and general counsel at Rambus. "We are hopeful when the district courts reconsider these decisions, they will find, as we believe, there was no bad faith and no prejudice."


38  Welcome to Fudzilla Forum / Discussion about Articles / Rambus-files-new-round-of-patent-suits-Source: on: December 29, 2010, 07:46:55 AM
39  Welcome to Fudzilla Forum / General Discussion / Intel-1155-Z68-Chipset-Mother-Board Heads-up on: December 22, 2010, 07:24:42 PM

...Heads-up 31Jan11... Intel finds design error in chip

Peter Clarke 1/31/2011

SANTA CLARA, Calif. - Intel has found a design error in a support chip for the recently announced Sandy Bridge processor.
The company says it has implemented a solution but that the error could cost the company $700 million.  


    The Loser In Our Windows vs. Linux Tests: Intel Graphics

Posted by Michael Larabel on April 30, 2010 http://www.phoronix.com/scan.php?page=news_item&px=ODIwMQ
We are still working on the first part of our Windows 7 vs. Ubuntu 10.04 LTS benchmarks that are set to be published early next week,
but so far there is one easy conclusion to draw from the completed tests: Intel's Linux graphics driver is still no match to the Intel Windows driver.
    Will Intel's Sandy Bridge & P67 Play Well With Linux?
Published on December 28, 2010
Written by Michael Larabel
Page 1 of 2 http://www.phoronix.com/scan.php?page=article&item=intel_sandybridge_linux&num=1
    There is also a matter of the Intel Linux graphics support...
    Jesse Barnes admits they sort of messed up with the Sandy Bridge launch.


The advantages of the Core i7 2600 are enhanced Read Write SSDs, Syncing and Video Codec speed increases.
The advantage of the Core i7 2600K is unlocking for Overclocking; however, there are none of the advantages of the 2600.



Intel DH67BL H67-Express Motherboard   
Reviews - Featured Reviews: Motherboards
Written by Hank Tolman  
Sunday, 02 January 2011 http://benchmarkreviews.com/index.php?option=com_content&task=view&id=632&Itemid=69&limit=1&limitstart=11
Page 12 of 18


 Sandybridge on board Graphics tested:
SandyBridge IGP HD G3000 review
Published on 2010/12/27 by mac

HD100 has been changed to HD2000
HD200 has been changed to HD3000

This is as good a place to begin the viewing as any:  http://en.inpai.com.cn/doc/enshowcont.asp?id=7949&pageid=7742
On the upper right hand side of the page are additional articles.

PAGE15: Final Words  http://en.inpai.com.cn/doc/enshowcont.asp?id=7949&pageid=7749


Related reports:
An Inpai writer stated that a Software Lucid Logic Program makes it possible
to combine Radeon and nVidia Graphics Cards on the same MotherBoard.
It was not stated specifically which Chipset was compatible...

More on Hydra Here: ...31Dec10...  http://www.lucidlogix.com/download/product-adventure2800_2_3991769098.pdf

01SNB series of 14 bombs, P67 dual card Internet x8 + x8 enough?
2011-01-21 11:50
02Intel Quick Sync HD video transcoding acceleration of Comparative
2011-01-13 17:37
03SNB series of 11 bombs, Intel Quick Sync transcoding acceleration test
2011-01-12 17:00
04SNB series of eight bomb, Sandy Bridge processor synchronization evaluation
2011-01-05 09:00
These topics discuss new additions to some of the i3, i5 and i7 Intel CPUs and may be available with the addition of
the Intel to be released Z68 Chipset.


Zotac mini / WiFi...






SandyBridge IGP HD G3000 review
Published on 2010/12/27 by mac    
Related reports: on upper right hand side of this page...


All Asrock Fatal1ty information is pre-release. The opening paragraph of this thread has information regarding Overclocking.


News flash:... Intel "Code Name" Sandy Bridge E to be released Q4 2011.
40  Welcome to Fudzilla Forum / Discussion about Articles / Editor's Desk: Sylvie and Tegra 2 on: December 17, 2010, 09:40:02 AM
Editor's Desk:


Written by Peter Scott  http://fudzilla.com/graphics/item/21251-nvidia-claims-200-sandy-bridge-design-wins
Green team in the green... (but not for long 05Jan11)

41  Welcome to Fudzilla Forum / Discussion about Articles / Editor's Desk: Last-Stand-for-Graphics-countdown-Source-Round-One on: December 14, 2010, 11:33:19 PM
"Last Stand for Graphics"
AMD Radeon vs NVIDIA GeForce: Graphics Last Stand   
Articles - Opinion & Editorials
Written by Olin Coles  
Wednesday, 15 December 2010
AMD Radeon vs NVIDIA GeForce: Last Stand for Graphics

NVIDIA's Fermi GF110-powered GeForce GTX 580 sets a high standard, so can AMD's Cayman GPU with VLIW4 architecture save the Radeon HD 6970?


INPAI Report
HD6850 CrossFire PK GTX580/HD5970 http://en.inpai.com.cn/doc/enshowcont.asp?id=7938
Published on 2010/11/23 by mac    
Related reports:

Before reading the article, many readers may still think that efficient and compatibility of CrossFire is not well.In fact, I can tell you that after several years development,CrossFire technology is gradually improving, the user need not worry about these history problems. this test can verify this fact .

In this test, I deliberately put performance of HD6850 CF with performance of single card in order to facilitate comparison.You can see that after set up HD6850 CrossFire,the improvement of performance is very huge,It most games performance are better than GTX580and part at least on par with that of HD5970 and even has a slight advantageThis proves the efficiency of current CrossFire is very good,It absolute can bring better gaming experience to players.



Tuesday, 14 December 2010 19:03
Radeon HD 6970 to cost 275 euro
Written by Fuad Abazovic  http://www.fudzilla.com/graphics/item/21210-radeon-hd-6970-to-cost-275-euro

Excellent price, 6950 for €225

Kudos to AMD for the price, the fight is on.



6900s Launch: 6:01 CET NDA Lifted



Round 1: Draw Round 2 coming right up
AMD: 1                nVidia: 1


Tweak Town Review:  http://www.tweaktown.com/cms/gallery.php?aid=3741&type=articles&title=amd_radeon_hd_6970_2gb_video_card_in_crossfire


The Monster's Review:  http://lab501.ro/placi-video/his-hd-6970-studiu-de-scalare-in-configuratii-multi-card


Zotac Sunday Punch: Best offering for the 580...

Yesterday photos became available from the "East". The hint was that there would not be enough copies to go around. Specs should be released today. "Cheap and Fast" by Zotac.


End Round two: There will be a delay. The fight may be called due to illegal activities and litigation...


Time-out: The fight may be continued after CES 2011


New Board in Town: Adventure 2800 /  soft Hydra

42  Welcome to Fudzilla Forum / General Discussion / From The Editors Desk: Intel... must be dreaming of Z68 Skull Trail MoBos on: December 10, 2010, 05:57:26 AM
1155 Z68 Chipset, Skull Trail MotherBoard, 32 nm Sandy Bridge
with HD 100 Graphics which has been renamed to HD 2000...
and HD 200 Graphics has been renamed HD 3000.






43  Hardware / Motherboard / 1155 Z68 Skull Trail Motherboard and a HD 200 Graphics Sandy Bridge on: December 09, 2010, 05:03:09 AM


44  Welcome to Fudzilla Forum / General Discussion / Lightening Fast... Lightening Strong... Coming in December... Rule the Air on: November 26, 2010, 04:21:05 AM
http://network4g.verizonwireless.com/#/4g-network-verizon-wireless USA, England...
45  Hardware / Graphics Cards / GF GTX 580 "not" available in US and CA on: November 25, 2010, 09:03:13 PM

The rumor that there were two thousand GF GTX 580s to be released may have credibility.
1000 to US and 1000 to EU...


      ...29Nov10...        Second shipment in stock at newegg: PNY, MSI, GALAXY and Palit  sold out
                                                               $500.00 - $530.00
                                                 We must be getting close to the 1000 mark

Check in Here for daily updates: http://www.newegg.com/Product/ProductList.aspx?Submit=ENE&DEPA=0&Order=BESTMATCH&Description=gtx+580&x=15&y=32

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