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Written by Peter Scott
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Monday, 17 November 2008 09:45 |
Mass production
TSMC has announced that it moved its 40nm process into volume production. The process uses 193-nm immersion lithography, ultra low-k material and low-power, triple-gate oxide is optional.
The latest advance puts TSMC ahead of its main rivals, IBM, Samsung and UMC. Many manufacturers have already announced their plans to go to 40nm, but at the moment it seems TSMC is the only company to have it in mass production.
Due to the economic downturn, TSMC has already seen its sales go down and it expects to utilize less than 75 percent of its production capacity in Q4. Foundry companies will obviously be among the first ones to see a drop in demand and revenue, months ahead of system integrators and makers of consumer electronics.
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