Based on TLC 3D NAND
According to the latest leaked slide, Intel is working on the new performance-segment 610P series SSD based on TLC 3D NAND, M.2 2280 form-factor and PCIe NVMe interface.
Low-profile NVMe storage package using 1.8v power instead of 3.3v
During Samsung’s 2016 SSD Forum in Japan, the company took the wraps off its first ever ball-grid array (BGA) solid state disk for mobile devices, the PM971.
A8-4557M and A10-4657M